Electronical Encapsulation Adhesives

Structural Bonding & Component Assembly

Technology

2K MMA

Model

Viscosity（mPa.s/25C）

Mixing ratio by volume

Open time.

(Min)

Initial strength Open time(s)

Tg

(dC)

CTE α1

CTE α2

Elongation, at break (%)

Tensile strength

(N/mm2)

Modulus

(N/mm2)

Shore hardness

TriAdhesive 2K MMA31

A: 15000

A:B=10:1

4

300

87

114X10-6

206X10-6

167

20

587

67D

B: 15000

TriAdhesive 2K MMA 31 is recommended for structure bonding in the electronic assemblies, such as PC, Pad. It’s suitable for the bonding between plastic and metal component like cover, frame to enclosure. It cures rapidly at room temperature to withstand impact and vibration.

Technology

UV Curing

Model

Viscosity（mPa.s/25C）

Light source（nm）

Light intensity(mW/cm2)

Fixture time

（s）

Gravity

Secondary curing

Refractive Index

Elongation, at break (%)

Tensile strength

(N/mm2)

Modulus

(N/mm2)

Shore hardness

TriAdhesive UV 32

25000

365~400**

100

10

1.12

--

--

85

13

490

--

220~260***

TriAdhesive UV 32 features thixotropic nature and shows good gap filling performance. It’s recommended for component assembly such as Lens holder in the CMOS assembling. It would be also used as the solder joint protection.

TriAdhesive UV 33

5000

365

100

5

1.08

--

1.48

250

18.6

255

53D

220~260

15

1.5

TriAdhesive UV 33 performs excellent adhesion to various substrates, with thixotropic nature. It minimizes the bleeding problem during the application. Typical applications are such as component assemblies, lens lock in CMOS, sealing in speaker etc.

TriAdhesive UV 34

2300

365

100

1

1.05

Heat cure

1.49

150

15.8

37.9

60D

TriAdhesive UV 34 has low modulus and low shrinkage after curing, can be use for the glass bonding application.

TriAdhesive UV 38

750

365

100

10

1.05

--

1.47

58

19

655

41A

TriAdhesive UV 38 is designed for the bonding between metal and glass. It could be used for the pin bonding and glass bonding, also can be used for the PCB Pad fixing

Technology

1K Epoxy

Model

Viscosity

（mPa.s/25C）

Gravity

Curing temp.

(dC)

Curing speed(min)

Tg

(dC)

CTE α1

CTE α2

Tensile strength

(N/mm2)

Modulus

(N/mm2)

Shore hardness

Storage

(dC)

TriAdhesive 1K Epo 21

7200

1.34

80

5~10

26

61X10-6

171X10-6

13

3240

79D

-18

TriAdhesive 1K Epo 22

59000

1.3

80

2

44

64X10-6

181X10-6

20

3370

79D

-18

TriAdhesive 1K Epo 21/22 are designed to cure at 80dC, to accommodate the heat sensitive component bonding, such as CMOS, FPS and MMC assembly

Technology

One component MS

Model

Viscosity(mPa.s/25C)

Gravity

Operation temp.

(dC)

Skin forming (min）

Tack free time(Hrs)

Curing speed

(mm/Day)

Elongation, at break

%

Tensile strength

(N/mm2)

Shear strength

(N/mm2)

Modulus

(N/mm2)

Shore hardness

TriAdhesive 

1K MSi 61

30000

1.11

5~40

6~10

1.0

2.0

160

2.4

2.51

2.0

47A

TriAdhesive 1K MSi 61 is one component silane modified polymer, by reacting with moisture to found elastic bonding. It performs adhesion to variety of substrate with high bond strength, ideal for device assembly and component assembly.

PCB/FPC Protection

Technology

UV Curing Acrylic

Model

Viscosity(mPa.s/25C)

Thixotropic index

Light source

(nm)

Light intensity(mW/cm2)

Secondary curing

Secondary curing(min)

Tg

(dC)

CTE α1

CTE α2

Shore hardness

Storage(dC)

TriAdhesive UVAc 35

7800

4.1

365

2000

Heat

10

26

108

211

27D

-20

TriAdhesive UVAc 35 is designed for Glob top encapsulating component on PCB application, when cure it provide protection in temperature/humidity/bias testing.

Technology

Silicones

Model

Viscosity

(mPa.s/25C)

Gravity

Mixing ratio

Refractive Indix

Curing speed @150dC (min)

Gel time@25dC

(min)

Volume resist.

(Ω*cm)

Dielectic constant(@1MHz）

Elongation, at break（%）

Tensile strength

(N/mm2)

Needle penetration

TriAdhesive Si 616

A：

0.97

1：1

1.404

2

35

1*1015

--

--

--

270

B：

0.97

1.404

TriAdhesive Si 616 is designed for sensitive component protection and require high reliability. It features excellent damping performance and ideal for electronic control module encapsulation and protection.

Technology

Modified Acrylics

Model

Viscosity

(mPa.s/25C)

Gravity

Light source(nm)

Light intensity(mW/cm2)

Secondary curing

Operation range (dC)

Dielectric constant（@1MHz）

Dissipation Factor

(@1MHz)

Volume resist. ( Ω-cm)

Surface resist. ( Ω)

Shore hardness

TriAdhesive MAc 36

250

1.08

365

300

Moisture

-40~135

2.75

12%

3.5X1016

3.8X1016

79D

TriAdhesive MAc 37

2300

1.05

320~400

200

Heat

-40~150

4.49

3%

1.48X1015

8.29X1014

60D

Technology

Modified PU

Model

Viscosity

(mPa.s/25C)

Gravity

Light source

(nm)

Light intensity(mW/cm2)

Secondary curing

Secondary curing speed (Hr)

Operation range (dC)

Dielectric constant（@1MHz）

Dissipation Factor

(@1MHz)

Volume resist. (Ω)

Shore hardness

TriAdhesive MPU 43

120

1.04

365

150~300

Moisture

~100

-40~105

3.34

1.3%

2.2X1016

60D

Technology

Modified Silicone

Model

Viscosity

(mPa.s/25C)

Gravity

Light source

（nm）

Light intensity(mW/cm2）

Secondary curing

Operation range（dC）

Elongation, at break

(%)

Tensile strength

(N/mm2)

Shear strength

(N/mm2)

Modulus

(N/mm2)

Shore hardness

TriAdhesive MSi 51

100~350

1.0

365

70

Moisture

-53~204

3.19

0.9%

2X1014

8X1016

-45A

TriAdhesive MSi 52

400~800

1.0

365

70

Moisture

-53~204

4.5

1.4%

1X1014

--

-40A

The above products are designed for conformal coating application with different viscosity, operation range and hardness etc. The dual curing technology enable the product to fix up rapidly under UV radiation, while in the shadow area, the coating can be further curing under heat or reaction with moisture.

Technology

Silicone

Model

Viscosity

(mPa.s/25C)

Gravity

Tack free

(min)

System

Tensile strength

（psi）

Elongation, at break

(%)

Dielectric constant（@100KHz）

Dissipation Factor

(@100KHz)

Volume resist.

(Ω-cm)

Surface resist. (Ω)

Shore hardness

TriAdhesive MSi 53

36000

1.05

115

Alkoxy

434

419

2.52

0.4%

2.1X1014

--

34A

Tri-Adhesiv MSi 53 is the self-leveling silicone for conformal coating. It features modest hardness and suitable for PCB protection and encapsulation.

Technology

Modified Acrylic

Model

Viscosity

(mPa.s/25C)

Gravity

Color

Light source

（nm）

Light intensity (mW/cm2)

Tg

(dC)

Modulus

(N/mm2)

WVTR（g/mil/

100inch2/day

Cl ion content（ppm）

Na ion content（ppm）

Shore hardness

TriAdhesive MAc 310

680

1.03

Light yellow

365

1000

67

75

16.2

6

1

66A

TriAdhesive MAc 311Bl

1750

0.97

Black

365~405

900~425

75

450

14

6

1

58A

TriAdhesive MAc 311Bl is designed for overcoat in LCD and OLED assemblies, which could be ready for Chip on glass（CoG）/Chip on Film（CoF）. While TriAdhesive MAc 311Bl is designed for CoG in LCD assemblies, both products feature rapid curing with excellent moisture barrier and enhance product’s reliability.

TriAdhesive MAc 312

1000

0.97

Light yellow

365

100

64

504

21

7

1

63A

TriAdhesive MAc 312 is design for FPC reinforcement and CoG in LCD assemblies to improve the FPC reliability

TP display bonding

Technology

Modified Acrylic

Model

Viscosity（mPa.s/25C）

Gravity

Light source

(nm)

Light intensity(mW/cm2)

Refractive Index

Elongation, at break（%）

Dielectric constant（@1MHz）

Dissipation Factor

(@1MHz)

Volume resist.

(Ω-cm)

Surface resist.

Ω

Shore hardness

TriAdhesive MAc 313

3800

0.93

375

100

1.51

235

2.72

0.031

2.4x1015

12x1016

<20OO

TriAdhesive MAc 314

2400

0.93

365

100

1.5

350

3.10

0.019

2.2x1015

10x1016

56A

Technology

Modified Silicone

Model

Viscosity（mPa.s/25C）

Gravity

Light source(nm)

Light intensity(mW/cm2)

Refractive Index

Elongation, at break（%）

Dielectric constant（@1MHz）

Dissipation Factor

（@1MHz）

Volume resist.

(Ω-cm)

Surface resist.

(Ω)

Shore hardness

TriAdhesive MSi 54

3500~5500

0.98

MPMA

200

1.41

155

2.87

0.4%

85X1012

≥150X1015

55~80

OO

Electrodeless H

340

Electrodeless D

840

Liquid Crystal Sealing

Technology

Acrylic

Model

Viscosity（mPa.s）

Light source

(nm)

Light intensity(mW/cm2)

Tg

(dC)

CTE α1

CTE α2

Dielectric constant（@1MHz）

Dissipation Factor

(@1MHz)

Volume resist.

(Ω-cm)

Surface resist.

(Ω)

Shore hardness

TriAdhesive Ac 315

12000

220~365

100

68

140X10-6

180X10-6

3.5

0.04

1.3x1016

4x1015

82D

Underfill

Technology

Epoxy

Model

Application

Viscosity

(mPa.s/25C)

Gravity

Curing temp.(dC)

Curing speed

(min)

Tg

(dC)

CTE α1

CTE α2

Modulus

(N/mm2)

Dielectric constant（@1GHz）

Dissipation Factor

TriAdhesive Epo 23

CSP/BGA

360

1.16

130~150

8~5

113

55

171

2610

3.19

0.0099

TriAdhesive Epo 24

CSP/WLCSP

BGA

340

1.24

130~160

10~3

133

51

172

2560

2.94

0.048

Glass thinning

Technology

Modified acrylic

Model

Viscosity（mPa.s/25C）

Color

Gravity

Fluoresce

Light source

(nm)

Light intensity

(mW/cm2)

Tensile strength

(N/mm2)

Elongation, at break(%)

PC/PC Shear strength

(N/mm2)

PEN/PEN Shear strength

(N/mm2)

Shore hardness

TriAdhesive MAc 316

9118

Red

1.09

Yes

320~405

100-500

12

200

4

10

7

Temporary bonding

Technology

Modified Acrylic

Model

Viscosity

(mPa.s/25C)

Gravity

Light source

(nm)

Light intensity

(mW/cm2)

Tensile strength

(N/mm2)

Elongation, at break(%)

Shrinkage

(%)

Tensile strength

(N/mm2)

Debonding temp.

(dC)

Debonding time

(min)

Shore hardness

TriAdhesive MAc 317

1450

0.96

320~400

100

19

80

4.5

0.2

100

10

84A

TriAdhesive MAc 318

5000

0.98

320~400

100

23

90

4.5

0.2

150

60

65D